尊龙集团有限公司

 Copper Clip Process Power Packaging

  ●Process Packaging of Anst's Copper Clip, used for power device packaging

                 

  ●Use the copper block to connect Source and lead-frame of MOS FET in order to get better Rdson and heating effect. 
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 Copper Clip Advantages

  ●Electrical Performance

  ●Thermal Performance  

 Clip Bond Application Fields